ISRI Scrap Specifications Circular

57 Guidelines for Electronics Scrap INSTITUTE OF SCRAP RECYCLING INDUSTRIES, INC. Copyright © 2022 Institute of Scrap Recycling Industries, Inc. “E-Dismantling” Dismantling is the manual demanufacturing of EOL elec- tronic products (electronic materials) to reuse or recycle components and commodities contained within. “E-Processor” Processor is a person who engages in the mechanical demanufacturing of EOL electronic products (electronic materials) to reuse or recycle various commodities con- tained within. “E-Processing” Processing is the mechanical demanufacturing of EOL elec- tronic products (electronic materials) to recover various commodities contained within. “E-Broker” Broker is a person who engages in the buying, selling, and trading of electronic products (electronic materials) without demanufacturing. “E-Brokering” Brokering is the buying, selling, and trading of electronic products (electronic materials) without demanufacturing. Electronics Scrap Metals—EM Preface: The following metals specifications are directed to processing plants generating value-added commodities for consumers producing metal products. All the specifications below are subject to final terms and conditions as agreed between buyer and seller. EM1—Eddy-Current (EC) Aluminum Shall consist of the shredded aluminum fraction generated by EC separation of electronic products being predominate- ly aluminum. Bulk density to be a minimum of 30 pounds per cubic foot (subject to terms between buyer and seller). Material may contain agreed-upon amounts of zinc and cop- per but shall not contain more than a total 5%maximum of nonmetallics, of which no more than 1% shall be rubber and plastics. To be free of excessively oxidized material and any sealed or pressurized items. Any variation to be sold by spe- cial arrangement between buyer and seller. Note: Refer to ISRI nonferrous specifications for Tweak or Twitch. EM2—Eddy-Current (EC) Scrap Shall consist of a combination of nonferrous metals that should be predominately aluminum but may contain statisti- cally significant percentages of zinc or other nonferrous metals. Bulk density to be a minimum of 30 pounds per cubic foot and subject to terms between buyer and seller. Material to be bought/sold under this guideline shall be identified as EM2 with a number to follow indicating the esti- mated percentage of nonferrous metal (e.g., EM2-90 means the material contains approximately 90% nonferrous metal content). May also be screened to permit description by spe- cific size ranges. Note: Refer to ISRI nonferrous specification for Zorba. Note: Specifications for clean aluminum scrap produced by demanufacturing or pretreating EOL scrap prior to shred- ding can be found under ISRI Guidelines for Nonferrous Scrap. For aluminum streams that contain less than 85% aluminum, consult the general aluminum scrap specifica- tions. EM3—Circuitboards and Shredded Circuitboards From the Processing of End-of-Life Electronics Shall consist of whole or shredded copper/precious metal- bearing populated or unpopulated circuitboards from the manual dismantling of electronic products. May also con- sist of shredded circuitboards from end-of-life electronic product processing systems with a maximum piece size of 2 inches. Maximum acceptable metal contamination: aluminum, 5%; ferrous, 2%; zinc, 2%; magnesium, 1%; and beryllium, 200 ppm. Other elements subject to agreement between buyer and seller. Maximum plastic content: 40%. Typically sold on an assay basis and classified into different categories denominated by the gold levels contained in the material. Major classifications are: 1) <50 grams per mt 2) <200 g/mt 3) >200 g/mt EM4—Light Iron Shall consist of whole No. 1 and whole No. 2 wrought iron and/or steel scrap and No.1 busheling from the manual dis- mantling of electronic products. Refer also to 200, 204, and 207 Guidelines for Ferrous Scrap. EM5—Iron Frag Shall consist of shredded No. 1 and No. 2 whole wrought iron and/or steel scrap and No. 1 busheling from end-of-life elec- tronic product processing systems. Refer also to 210 and 211 Guidelines for Ferrous Scrap. Electronics Scrap Glass and CRT Cullet Specifications Shipping/Packaging/Labeling—All shipments shall be packaged, labeled, and transported in accordance with all applicable transportation laws and packed in a manner that prevents releases to the environment and protects the health and safety of workers handling the material at gener- ating or receiving facilities. Whole Monitors/TVs with or with cords. The equipment is intact with housing. Minimal to no disassembly has occurred. Whole Intact Tubes with gun and vacuum intact or released and with or without the band. Whole Tubes without gun and with or without the band. Processed Tubes to include both funnel and panel glass. Particle size will be determined by contract between shipper and smelter or treatment facility. Material should be free of all loose metals, bands, and shadow masks. May or may not be cleaned prior to shipping. Leaded Funnel Glass and Frit for smelting or other recov- ery/treatment. This material may include up to 10% panel glass. May or may not be cleaned prior to shipment. Particle size will be determined by contract between shipper and smelter or treatment facility.

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